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  • ATP Tube
  • Vias: Au or Cu Solid Filled
  • Microstrip Transmission Lines
  • Polyimide Supported Bridges
  • Solder Dams
Welcome To ATP

Applied Thin-Film Products (ATP) was founded in the heart of Silicon Valley specifically for the purpose of providing state-of-the-art thin-film circuit processing. ATP’s manufacturing facility and cleanrooms were designed and setup for thin-film circuit fabrication. ATP’s experienced personnel and representatives possess motivation and integrity which is reflected by the reputation we enjoy in the Wireless RF and Microwave field. ATP takes great pride in delivering superior processing and products with punctual delivery and competitive pricing.

ATP 2016 EDI CON Show   ATP 2016 EDI CON Show

2016 EDI CON Show

ATP 2016 Tradeshow Booth   ATP 2016 Tradeshow Booth

New 2016 Trade Show Booth

Disclaimer

ATP has made every effort to have this information as accurate as possible. However no responsibility is assumed by ATP for its use, nor for any infringements of rights of third parties which may result from its use. ATP reserves the right to revise the content or modify its product without prior notice.

 
Thin-Film Fabrication

Complete In-House Thin-Film Circuit Fabrication Service

Quick Turn Engineering Prototypes

In-House Pattern Generated Photomasks

In-House Resistor Laser Trimming and CO2 Laser Drilling

Multiple Sputtering Systems and Plating Capabilities

Air Bridges/Crossovers with Polyimide and Solder Dams

Wide Selection of Materials and Metallizations

Hollow Plated and Solid Filled Via Capabilities

AI203, AIN, BeO, Fused Silica/Quartz, Sapphire and Hi-K Dielectrics

Multiple Part Number Array (Pizza Array) Capability

Predeposited Gold/Tin (Au/Sn)

High-Rel Screening: Bond Pull, Die Shear, Temp Shock, Temp Cycle, Burn In per MIL-PRF-38534

AS9100 Certified and ISO 9001:2008 Certified

ITAR Registered as a defense contractor with the United States Department of State, Office of Defense Trade Controls and Compliance

ATP complies with the U.S. Dodd-Frank Wall Street Reform and Consumer Protection Act concerning “conflict minerals” originating from the Democratic Republic of the Congo (DRC) or adjoining countries. A copy of the current CFSI Declaration can be supplied to customers upon request

 
News

New products and capabilities coming soon!
Aluminum Bonding Pads, Chip Resistors, 200 WmK AlN Material.

New... Inductor Coils Engineering Kits!

ATP introduces the new Inductor Coils Engineering Kit with a line of spiral inductor coils in a wide range of values from 2.2nH to 112.7nH. These coils have been modeled and optimized using advanced computer automated design tools to produce data and graphs to help you utilize these devices in your own thin-film or hybrid designs. More...

New... Transmission Lines Engineering Kits!

ATP is pleased to offer new Microstrip Transmission Lines Engineering Kits to help your bread-boarding needs with a cost effective solution. More...

New... Chip Trays!

ATP has an extensive inventory of industry standard chip trays (waffle packs) to meet your packaging needs. More...

 
Events

ATP is celebrating 20 years of value added services, so please visit us at the following upcoming shows for exciting new products and services.

Photonics West

February 5 – 7, 2019
San Francisco, CA

Moscone Center
Booth 5563

spie.org

OFC

March 5 – 7, 2019
San Diego, CA

San Diego Convention Center
Booth 3457

www.ofcconference.org

SPIE Photonics West 2020

February 1–6, 2020
San Francisco, CA

The Moscone Center

Website

Company Technologies Capabilities Design Guidelines Products Other

Introduction

Polyimide Bridges

Photomasks

Standard Dimensions, Tolerances

Inductor Coils

Home

Quality Assurance

Solder Dams

Substrates

CAD Data Guidelines

Inductor Coils Eng. Kit

Contact Us

Directions

Laser Diode Submounts

Material Specifications

Material and Conversion Tables

Microstrip Transmission Lines

Terms of Use

Employment

Vias: Plated Through

Ion Beam

Thermal Performance

Transmission Lines Eng. Kits

Privacy Policy

Sales Rep’s

Vias: Au or Cu Solid Filled

Aluminum Bonding Pads

Aging Equation

Stand Off/Isolation Pads

Facebook

Contact Us

Edge Wraps

Laser Machining/Drilling

Safe Current Limits

ATP Bond Qualification Coupons

YouTube

 

Gold Bumping

Backside Burnishing

Design Resources

Product Samples

 
 

Fractal Fasten

Standard Metallizations

 

Packaging/Chip Trays

 
   

Integrated TaN Resistors

 

Thin Film Resistor and Multi-Tap

 
   

Laser Resistor Trimming

     
   

Serialization